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Semiconductor Packaging: Future Is Now – Prof. Swaminathan, Georgia Tech

April 14 @ 3:04 pm - 4:04 pm EST

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After providing a brief introduction into the reasons why heterogeneous integration using semiconductor packaging is a means to continue Moore’s law, I will present on some of our recent advances and contributions in System on Package (SoP) technologies, a concept that we have been pioneering for almost three decades, that has relevance to emerging applications in Artificial Intelligence, Wireless Communications, Automotive, and Harsh Environments.

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April 14
3:04 pm - 4:04 pm EST
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